LITEON Technology debuts its 800 VDC power architecture at the OCP Global Summit, strengthening its role in the AI infrastructure supply chain alongside NVIDIA.
LITEON Technology is positioning itself as a critical supplier for AI infrastructure by showcasing its advanced power management solutions at the OCP Global Summit 2026. The company is specifically highlighting its NVIDIA 800 VDC architecture and comprehensive thermal management portfolio, which are essential for supporting the high-power requirements of next-generation AI data centers.
LITEON is presenting its next-generation grid-to-chip energy architecture, specifically featuring its NVIDIA 800 VDC architecture and thermal management solutions.
It is designed to meet the high-power density and efficiency requirements of modern AI infrastructure, facilitating better energy management from the grid to the chip.
NVIDIA's 800 VDC architecture is featured in LITEON's showcase, reinforcing its adoption in next-generation AI data centers.
LITEON Technology is showcasing its latest grid-to-chip energy architecture at the OCP Global Summit in San Jose. The portfolio features advanced thermal management and power solutions designed to support NVIDIA's 800 VDC infrastructure for next-generation AI data centers.
The 800 VDC architecture is designed to improve power efficiency and thermal management for high-density AI data centers, aligning with NVIDIA's latest infrastructure standards.